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Stiftleisten, Spezialstift

Hersteller	Serie	Verpackung	Produktstatus	Anschlusstyp	Kontakttyp	Anzahl der Positionen	Abstand	Anzahl der Reihen	Reihenabstand	Montageart	Anschluss	Funktionen	Kontaktoberfläche	Kontaktoberfläche Dicke	Farbe
Aries Electronics ASSMANN WSW Components CnC Tech CWB Electronics Glenair Harwin Inc. Mill-Max Manufacturing Corp. Omron Electronics Inc-EMC Div Preci-Dip Samtec Inc. TE Connectivity AMP Connectors	* - 0600 0625 134 142 150 151 153 160 162 163 170 173 180 182 183 334 342 350 351 360 363 370 373 380 383 442 451 460 463 470 473 480 483 551 600 625 675 680 800 802 8136 830 832 850 852 AW 122 HTS TD TS XR2	Box Bulk Tray Tube	Active Obsolete	- DIP, DIL - Header Grid Array Header Header Strip Plug SIP, SIL - Header	- Forked Male Pin Mating Target Post Post, Extended Slotted Solder Cup Turret	- 1 10 100 101 (13 x 13) 11 12 13 14 15 16 17 18 19 2 20 21 22 23 24 25 26 27 28 29 3 30 31 32 33 34 35 36 37 38 39 4 40 41 42 43 44 45 46 47 48 49 5 50 51 52 53 54 55 56 57 58 59 6 6 (2 + 4 Power) 60 61 62 63 64 66 68 7 70 72 74 76 78 8 80 82 84 86 88 9 90 92 94 96 98	- 0.050" (1.27mm) 0.070" (1.78mm) 0.079" (2.00mm) 0.100" (2.54mm) 0.200" (5.08mm)	- 1 2	- 0.050" (1.27mm) 0.079" (2.00mm) 0.100" (2.54mm) 0.200" (5.08mm) 0.300" (7.62mm) 0.400" (10.16mm) 0.600" (15.24mm) 0.700" (17.78mm) 0.750" (19.05mm) 0.800" (20.32mm) 0.900" (22.86mm)	- Surface Mount Through Hole Through Hole, Right Angle	- Solder Wire Wrap	- Cap (Cover) Programmable Programmed	- Gold Tin Tin-Lead	- 10.0µin (0.25µm) 137.8µin (3.50µm) 20.0µin (0.51µm) 200.0µin (5.08µm) 29.5µin (0.75µm) 30.0µin (0.76µm) 50.0µin (1.27µm) Flash	- Black

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Foto	Herst.-Teilenr.	Verfügbarkeit	Preis	Menge	Datenblatt	Serie	Verpackung	Produktstatus	Anschlusstyp	Kontakttyp	Anzahl der Positionen	Abstand	Anzahl der Reihen	Reihenabstand	Montageart	Anschluss	Funktionen	Kontaktoberfläche	Kontaktoberfläche Dicke	Farbe
	14-0600-21 CONN HDR DIP POST 14POS GOLD Aries Electronics	239	-	RFQ	Datenblatt	0600	Bulk	Active	DIP, DIL - Header	Post	14	0.100" (2.54mm)	1	-	Through Hole	Solder	-	Gold	10.0µin (0.25µm)	Black
	20-0600-21 CONN HDR DIP POST 20POS GOLD Aries Electronics	267	-	RFQ	Datenblatt	0600	Bulk	Active	DIP, DIL - Header	Post	20	0.100" (2.54mm)	1	-	Through Hole	Solder	-	Gold	10.0µin (0.25µm)	Black
	04-600-11 CONN HDR DIP FORK 4POS GOLD Aries Electronics	903	-	RFQ	Datenblatt	600	Bulk	Active	DIP, DIL - Header	Forked	4	0.100" (2.54mm)	2	0.300" (7.62mm)	Through Hole	Solder	-	Gold	10.0µin (0.25µm)	Black
	16-675-191 CONN HDR MALE PIN 16POS GOLD Aries Electronics	161	-	RFQ	Datenblatt	675	Bulk	Active	Header	-	16	0.100" (2.54mm)	2	0.300" (7.62mm)	Through Hole	Solder	Programmable	Gold	-	Black
	24-600-10 CONN HDR DIP FORK 24POS TIN Aries Electronics	112	-	RFQ	Datenblatt	600	Bulk	Active	DIP, DIL - Header	Forked	24	0.100" (2.54mm)	2	0.600" (15.24mm)	Through Hole	Solder	-	Tin	200.0µin (5.08µm)	Black
	28-600-10 CONN HDR DIP FORK 28POS TIN Aries Electronics	261	-	RFQ	Datenblatt	600	Tube	Active	DIP, DIL - Header	Forked	28	0.100" (2.54mm)	2	0.600" (15.24mm)	Through Hole	Solder	-	Tin	200.0µin (5.08µm)	Black
	14-680-191T CONN HDR MALE PIN 14POS TIN Aries Electronics	460	-	RFQ	Datenblatt	680	Bulk	Active	Header	-	14	0.100" (2.54mm)	2	0.300" (7.62mm)	Through Hole	Solder	Programmable	Tin	50.0µin (1.27µm)	Black
	08-680-190T CONN HDR MALE PIN 8POS TIN Aries Electronics	1,016	-	RFQ	Datenblatt	680	Tray	Active	Header	-	8	0.100" (2.54mm)	2	0.300" (7.62mm)	Through Hole	Solder	Programmable	Tin	50.0µin (1.27µm)	Black
	08-675-191 CONN HDR MALE PIN 8POS GOLD Aries Electronics	63	-	RFQ	Datenblatt	675	Bulk	Active	Header	-	8	0.100" (2.54mm)	2	0.300" (7.62mm)	Through Hole	Solder	Programmable	Gold	-	Black
	40-600-10 CONN HDR DIP FORK 40POS TIN Aries Electronics	81	-	RFQ	Datenblatt	600	Bulk	Active	DIP, DIL - Header	Forked	40	0.100" (2.54mm)	2	0.600" (15.24mm)	Through Hole	Solder	-	Tin	200.0µin (5.08µm)	Black

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