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Stiftleisten, Spezialstift

Hersteller	Serie	Verpackung	Produktstatus	Anschlusstyp	Kontakttyp	Anzahl der Positionen	Abstand	Anzahl der Reihen	Reihenabstand	Montageart	Anschluss	Funktionen	Kontaktoberfläche	Kontaktoberfläche Dicke	Farbe
Aries Electronics ASSMANN WSW Components CnC Tech CWB Electronics Glenair Harwin Inc. Mill-Max Manufacturing Corp. Omron Electronics Inc-EMC Div Preci-Dip Samtec Inc. TE Connectivity AMP Connectors	* - 0600 0625 134 142 150 151 153 160 162 163 170 173 180 182 183 334 342 350 351 360 363 370 373 380 383 442 451 460 463 470 473 480 483 551 600 625 675 680 800 802 8136 830 832 850 852 AW 122 HTS TD TS XR2	Box Bulk Tray Tube	Active Obsolete	- DIP, DIL - Header Grid Array Header Header Strip Plug SIP, SIL - Header	- Forked Male Pin Mating Target Post Post, Extended Slotted Solder Cup Turret	- 1 10 100 101 (13 x 13) 11 12 13 14 15 16 17 18 19 2 20 21 22 23 24 25 26 27 28 29 3 30 31 32 33 34 35 36 37 38 39 4 40 41 42 43 44 45 46 47 48 49 5 50 51 52 53 54 55 56 57 58 59 6 6 (2 + 4 Power) 60 61 62 63 64 66 68 7 70 72 74 76 78 8 80 82 84 86 88 9 90 92 94 96 98	- 0.050" (1.27mm) 0.070" (1.78mm) 0.079" (2.00mm) 0.100" (2.54mm) 0.200" (5.08mm)	- 1 2	- 0.050" (1.27mm) 0.079" (2.00mm) 0.100" (2.54mm) 0.200" (5.08mm) 0.300" (7.62mm) 0.400" (10.16mm) 0.600" (15.24mm) 0.700" (17.78mm) 0.750" (19.05mm) 0.800" (20.32mm) 0.900" (22.86mm)	- Surface Mount Through Hole Through Hole, Right Angle	- Solder Wire Wrap	- Cap (Cover) Programmable Programmed	- Gold Tin Tin-Lead	- 10.0µin (0.25µm) 137.8µin (3.50µm) 20.0µin (0.51µm) 200.0µin (5.08µm) 29.5µin (0.75µm) 30.0µin (0.76µm) 50.0µin (1.27µm) Flash	- Black

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Foto	Herst.-Teilenr.	Verfügbarkeit	Preis	Menge	Datenblatt	Serie	Verpackung	Produktstatus	Anschlusstyp	Kontakttyp	Anzahl der Positionen	Abstand	Anzahl der Reihen	Reihenabstand	Montageart	Anschluss	Funktionen	Kontaktoberfläche	Kontaktoberfläche Dicke	Farbe
	380-10-110-10-003000 CONN HDR STRIP SOLDER 10POS GOLD Mill-Max Manufacturing Corp.	71	-	RFQ	Datenblatt	380	Tube	Active	Header	Solder Cup	10	0.100" (2.54mm)	1	-	Through Hole, Right Angle	Solder	-	Gold	10.0µin (0.25µm)	Black
	134-10-316-00-050000 CONN HDR DIP POST 16POS GOLD Mill-Max Manufacturing Corp.	49	-	RFQ	Datenblatt	134	Tube	Active	DIP, DIL - Header	Post, Extended	16	0.100" (2.54mm)	2	0.300" (7.62mm)	Through Hole	Solder	-	Gold	10.0µin (0.25µm)	Black
	151-10-304-00-003000 CONN HDR DIP POST 4POS GOLD Mill-Max Manufacturing Corp.	97	-	RFQ	Datenblatt	151	Tube	Active	DIP, DIL - Header	Post, Extended	4	0.100" (2.54mm)	2	0.300" (7.62mm)	Through Hole	Solder	-	Gold	10.0µin (0.25µm)	Black
	334-40-101-00-020000 CONN HDR POST 1POS TIN Mill-Max Manufacturing Corp.	47	-	RFQ	Datenblatt	334	Bulk	Active	Header	Post	1	-	1	-	Through Hole	Solder	-	Tin	200.0µin (5.08µm)	Black
	334-10-101-00-010000 CONN HDR POST 1POS GOLD Mill-Max Manufacturing Corp.	50	-	RFQ	Datenblatt	334	Bulk	Active	Header	Post, Extended	1	-	1	-	Through Hole	Solder	-	Gold	10.0µin (0.25µm)	Black
	334-10-101-00-020000 CONN HDR POST 1POS GOLD Mill-Max Manufacturing Corp.	50	-	RFQ	Datenblatt	334	Bulk	Active	Header	Post	1	-	1	-	Through Hole	Solder	-	Gold	10.0µin (0.25µm)	Black
	370-10-102-00-001000 CONN HDR TURRET 2POS GOLD Mill-Max Manufacturing Corp.	50	-	RFQ	Datenblatt	370	Bulk	Active	Header	Turret	2	0.100" (2.54mm)	1	-	Through Hole	Solder	-	Gold	10.0µin (0.25µm)	Black
	334-10-101-00-000000 CONN HDR POST 1POS GOLD Mill-Max Manufacturing Corp.	44	-	RFQ	Datenblatt	334	Bulk	Active	Header	Post, Extended	1	-	1	-	Through Hole	Solder	-	Gold	10.0µin (0.25µm)	Black
	142-90-316-00-592000 CONN HDR DIP POST 16POS TIN-LEAD Mill-Max Manufacturing Corp.	50	-	RFQ	Datenblatt	142	Tube	Active	DIP, DIL - Header	Post, Extended	16	0.100" (2.54mm)	2	0.300" (7.62mm)	Through Hole	Solder	-	Tin-Lead	200.0µin (5.08µm)	Black
	334-10-104-00-010000 CONN HDR POST 4POS GOLD Mill-Max Manufacturing Corp.	44	-	RFQ	Datenblatt	334	Tube	Active	Header	Post, Extended	4	0.100" (2.54mm)	1	-	Through Hole	Solder	-	Gold	10.0µin (0.25µm)	Black

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