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Stiftleisten, Spezialstift

Hersteller	Serie	Verpackung	Produktstatus	Anschlusstyp	Kontakttyp	Anzahl der Positionen	Abstand	Anzahl der Reihen	Reihenabstand	Montageart	Anschluss	Funktionen	Kontaktoberfläche	Kontaktoberfläche Dicke	Farbe
Aries Electronics ASSMANN WSW Components CnC Tech CWB Electronics Glenair Harwin Inc. Mill-Max Manufacturing Corp. Omron Electronics Inc-EMC Div Preci-Dip Samtec Inc. TE Connectivity AMP Connectors	* - 0600 0625 134 142 150 151 153 160 162 163 170 173 180 182 183 334 342 350 351 360 363 370 373 380 383 442 451 460 463 470 473 480 483 551 600 625 675 680 800 802 8136 830 832 850 852 AW 122 HTS TD TS XR2	Box Bulk Tray Tube	Active Obsolete	- DIP, DIL - Header Grid Array Header Header Strip Plug SIP, SIL - Header	- Forked Male Pin Mating Target Post Post, Extended Slotted Solder Cup Turret	- 1 10 100 101 (13 x 13) 11 12 13 14 15 16 17 18 19 2 20 21 22 23 24 25 26 27 28 29 3 30 31 32 33 34 35 36 37 38 39 4 40 41 42 43 44 45 46 47 48 49 5 50 51 52 53 54 55 56 57 58 59 6 6 (2 + 4 Power) 60 61 62 63 64 66 68 7 70 72 74 76 78 8 80 82 84 86 88 9 90 92 94 96 98	- 0.050" (1.27mm) 0.070" (1.78mm) 0.079" (2.00mm) 0.100" (2.54mm) 0.200" (5.08mm)	- 1 2	- 0.050" (1.27mm) 0.079" (2.00mm) 0.100" (2.54mm) 0.200" (5.08mm) 0.300" (7.62mm) 0.400" (10.16mm) 0.600" (15.24mm) 0.700" (17.78mm) 0.750" (19.05mm) 0.800" (20.32mm) 0.900" (22.86mm)	- Surface Mount Through Hole Through Hole, Right Angle	- Solder Wire Wrap	- Cap (Cover) Programmable Programmed	- Gold Tin Tin-Lead	- 10.0µin (0.25µm) 137.8µin (3.50µm) 20.0µin (0.51µm) 200.0µin (5.08µm) 29.5µin (0.75µm) 30.0µin (0.76µm) 50.0µin (1.27µm) Flash	- Black

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Foto	Herst.-Teilenr.	Verfügbarkeit	Preis	Menge	Datenblatt	Serie	Verpackung	Produktstatus	Anschlusstyp	Kontakttyp	Anzahl der Positionen	Abstand	Anzahl der Reihen	Reihenabstand	Montageart	Anschluss	Funktionen	Kontaktoberfläche	Kontaktoberfläche Dicke	Farbe
	150-10-304-00-001000 CONN HDR DIP POST 4POS GOLD Mill-Max Manufacturing Corp.	102	-	RFQ	Datenblatt	150	Tube	Active	DIP, DIL - Header	Post	4	0.100" (2.54mm)	2	0.300" (7.62mm)	Through Hole	Solder	-	Gold	10.0µin (0.25µm)	Black
	134-10-304-00-000000 CONN HDR DIP POST 4POS GOLD Mill-Max Manufacturing Corp.	102	-	RFQ	Datenblatt	134	Tube	Active	DIP, DIL - Header	Post, Extended	4	0.100" (2.54mm)	2	0.300" (7.62mm)	Through Hole	Solder	-	Gold	10.0µin (0.25µm)	Black
	150-10-316-00-106000 CONN HDR DIP POST 16POS GOLD Mill-Max Manufacturing Corp.	995	-	RFQ	Datenblatt	150	Tube	Active	DIP, DIL - Header	Post	16	0.100" (2.54mm)	2	0.300" (7.62mm)	Surface Mount	Solder	-	Gold	10.0µin (0.25µm)	Black
	342-10-102-00-591000 CONN HDR DIP POST 2POS GOLD Mill-Max Manufacturing Corp.	3,323	-	RFQ	Datenblatt	342	Bulk	Active	DIP, DIL - Header	Post, Extended	2	0.100" (2.54mm)	1	-	Through Hole	Solder	-	Gold	10.0µin (0.25µm)	Black
	380-10-101-00-001000 CONN HDR SOLDER 1POS GOLD Mill-Max Manufacturing Corp.	1,034	-	RFQ	Datenblatt	380	Bulk	Active	Header	Solder Cup	1	-	1	-	Through Hole	Solder	-	Gold	10.0µin (0.25µm)	Black
	342-10-103-00-591000 CONN HDR DIP POST 3POS GOLD Mill-Max Manufacturing Corp.	507	-	RFQ	Datenblatt	342	Tube	Active	DIP, DIL - Header	Post, Extended	3	0.100" (2.54mm)	1	-	Through Hole	Solder	-	Gold	10.0µin (0.25µm)	Black
	342-10-104-00-591000 CONN HDR DIP POST 4POS GOLD Mill-Max Manufacturing Corp.	1,835	-	RFQ	Datenblatt	342	Bulk	Active	DIP, DIL - Header	Post, Extended	4	0.100" (2.54mm)	1	-	Through Hole	Solder	-	Gold	10.0µin (0.25µm)	Black
	380-10-102-00-001000 CONN HDR SOLDER 2POS GOLD Mill-Max Manufacturing Corp.	2,978	-	RFQ	Datenblatt	380	Bulk	Active	Header	Solder Cup	2	0.100" (2.54mm)	1	-	Through Hole	Solder	-	Gold	10.0µin (0.25µm)	Black
	342-10-103-00-593000 CONN HDR DIP POST 3POS GOLD Mill-Max Manufacturing Corp.	948	-	RFQ	Datenblatt	342	Bulk	Active	DIP, DIL - Header	Post, Extended	3	0.100" (2.54mm)	1	-	Through Hole	Solder	-	Gold	10.0µin (0.25µm)	Black
	380-10-103-00-001000 CONN HDR SOLDER 3POS GOLD Mill-Max Manufacturing Corp.	329	-	RFQ	Datenblatt	380	Bulk	Active	Header	Solder Cup	3	0.100" (2.54mm)	1	-	Through Hole	Solder	-	Gold	10.0µin (0.25µm)	Black

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