System On Chip (SoC)
| Foto | Herst.-Teilenr. | Verfügbarkeit | Menge | Datenblatt | Serie | Verpackung/Gehäuse | Verpackung | Produktstatus | Architektur | Core-Prozessor | Flash-Größe | RAM-Größe | Peripheriegeräte | Konnektivität | Geschwindigkeit | Primäre Attribute | Betriebstemperatur | Klasse | Qualifizierung | Lieferant Gerätepaket |
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XCVP1502-2LSEVSVA3340IC VERSAL PREM ACAP FPGA 3340BGA |
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Versal® Premium | 3340-BFBGA, FCBGA | Tray | Active | MPU, FPGA | Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ | - | 256KB | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 450MHz, 1.08GHz | Versal™ Premium FPGA, 3.7M Logic Cells | 0°C ~ 100°C (TJ) | - | - | 3340-FCBGA (55x55) |
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AGFA027R24C2I1VIC FPGA AGILEX-F 2340FBGA |
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Agilex F | - | Tray | Active | MPU, FPGA | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | - | 256KB | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 1.4GHz | FPGA - 2.7M Logic Elements | -40°C ~ 100°C (TJ) | - | - | - |
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AGFA027R24C2I1VBIC FPGA AGILEX-F 2340BGA |
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Agilex F | 2340-BFBGA Exposed Pad | Tray | Active | MPU, FPGA | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | - | 256KB | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 1.4GHz | FPGA - 2.7M Logic Elements | -40°C ~ 100°C (TJ) | - | - | 2340-BGA (45x42) |
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AGFB027R24C2I1VIC FPGA AGILEX-F 2340FBGA |
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Agilex F | - | Tray | Active | MPU, FPGA | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | - | 256KB | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 1.4GHz | FPGA - 2.7M Logic Elements | -40°C ~ 100°C (TJ) | - | - | - |
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AGIB027R31B1E2VIC FPGA AGILEX-I 3184FBGA |
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Agilex I | - | Tray | Active | MPU, FPGA | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | - | 256KB | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 1.4GHz | FPGA - 2.7M Logic Elements | 0°C ~ 100°C (TJ) | - | - | - |
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AGIB027R31B2E1VIC FPGA AGILEX-I 3184FBGA |
0 |
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Agilex I | - | Tray | Active | MPU, FPGA | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | - | 256KB | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 1.4GHz | FPGA - 2.7M Logic Elements | 0°C ~ 100°C (TJ) | - | - | - |
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AGIB027R31B1E2VBIC FPGA AGILEX-I 3184BGA |
0 |
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Agilex I | 3184-BFBGA Exposed Pad | Tray | Active | MPU, FPGA | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | - | 256KB | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 1.4GHz | FPGA - 2.7M Logic Elements | 0°C ~ 100°C (TJ) | - | - | 3184-BGA (56x45) |
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AGIB027R31B2E1VBIC FPGA AGILEX-I 3184BGA |
0 |
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Agilex I | 3184-BFBGA Exposed Pad | Tray | Active | MPU, FPGA | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | - | 256KB | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 1.4GHz | FPGA - 2.7M Logic Elements | 0°C ~ 100°C (TJ) | - | - | 3184-BGA (56x45) |
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AGFB027R24C2I1VBAGFB027R24C2I1VB |
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Agilex F | 2340-BFBGA Exposed Pad | Tray | Active | MPU, FPGA | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | - | 256KB | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 1.4GHz | FPGA - 2.7M Logic Elements | -40°C ~ 100°C (TJ) | - | - | 2340-BGA (45x42) |
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AGIB027R29A2I3VIC FPGA AGILEX-I 2957BGA |
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Agilex I | 2957-BFBGA Exposed Pad | Tray | Active | MPU, FPGA | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | - | 256KB | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 1.4GHz | FPGA - 2.7M Logic Elements | -40°C ~ 100°C (TJ) | - | - | 2957-BGA (56x45) |
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AGIB022R29A2I2VBIC FPGA AGILEX-I 2957BGA |
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Agilex I | 2957-BFBGA Exposed Pad | Tray | Active | MPU, FPGA | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | - | 256KB | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 1.4GHz | FPGA - 2.2M Logic Elements | -40°C ~ 100°C (TJ) | - | - | 2957-BGA (56x45) |
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AGIB022R29A2I2VAGIB022R29A2I2V |
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Agilex I | 2957-BFBGA Exposed Pad | Tray | Active | MPU, FPGA | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | - | 256KB | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 1.4GHz | FPGA - 2.2M Logic Elements | -40°C ~ 100°C (TJ) | - | - | 2957-BGA (56x45) |
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AGIB027R29B1E2VAGIB027R29B1E2V |
0 |
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Agilex I | - | Tray | Active | MPU, FPGA | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | - | 256KB | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 1.4GHz | FPGA - 2.7M Logic Elements | 0°C ~ 100°C (TJ) | - | - | - |
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XCZU48DR-L2FSVE1156IIC ZUP RFSOC A53 FPGA LP 1156BGA |
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Zynq® UltraScale+™ RFSoC | 1156-BBGA, FCBGA | Tray | Active | MCU, FPGA | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | - | 256KB | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 533MHz, 1.333GHz | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | -40°C ~ 100°C (TJ) | - | - | 1156-FCBGA (35x35) |
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XCZU48DR-L2FFVE1156IIC ZUP RFSOC A53 FPGA LP 1156BGA |
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Zynq® UltraScale+™ RFSoC | 1156-BBGA, FCBGA | Tray | Active | MCU, FPGA | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | - | 256KB | DDR, DMA, PCIe | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 533MHz, 1.333GHz | Zynq®UltraScale+™ FPGA, 930K+ Logic Cells | -40°C ~ 100°C (TJ) | - | - | 1156-FCBGA (35x35) |
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AGIB023R18A1I1VIC FPGA AGILEX-I 1805FBGA |
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Agilex I | 1805-BBGA Exposed Pad | Tray | Active | MPU, FPGA | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | - | 256KB | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 1.4GHz | FPGA - 2.3M Logic Elements | -40°C ~ 100°C (TJ) | - | - | 1805-BGA (42.5x42.5) |
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AGIB023R18A1I1VBIC FPGA AGILEX-I 1805BGA |
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Agilex I | 1805-BBGA Exposed Pad | Tray | Active | MPU, FPGA | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | - | 256KB | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 1.4GHz | FPGA - 2.3M Logic Elements | -40°C ~ 100°C (TJ) | - | - | 1805-BGA (42.5x42.5) |
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AGFA027R31C2E4XIC FPGA AGILEX-F 3184FBGA |
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Agilex F | - | Tray | Active | MPU, FPGA | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | - | 256KB | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 1.4GHz | FPGA - 2.7M Logic Elements | 0°C ~ 100°C (TJ) | - | - | - |
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AGIB022R31A1I2VAGIB022R31A1I2V |
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Agilex I | 3184-BFBGA Exposed Pad | Tray | Active | MPU, FPGA | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | - | 256KB | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 1.4GHz | FPGA - 2.2M Logic Elements | -40°C ~ 100°C (TJ) | - | - | 3184-BGA (56x45) |
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AGIB022R31A2I1VAGIB022R31A2I1V |
0 |
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Agilex I | 3184-BFBGA Exposed Pad | Tray | Active | MPU, FPGA | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, ARM NEON, Floating point | - | 256KB | DMA, WDT | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | 1.4GHz | FPGA - 2.2M Logic Elements | -40°C ~ 100°C (TJ) | - | - | 3184-BGA (56x45) |
Kategorieübersicht
System On Chip (SoC) Produkte und Auswahlhilfe
System On Chip (SoC) werden in Industrieautomation, Automobilelektronik, Kommunikationstechnik, Unterhaltungselektronik, erneuerbaren Energien und vielen weiteren elektronischen Systemen eingesetzt. Wir bieten Produkte verschiedener Hersteller, Gehäuseformen und Spezifikationen zur einfachen Auswahl und Beschaffung.
Filtern Sie System On Chip (SoC) nach Hersteller, wichtigen Parametern, Verfügbarkeit und Datasheet. Wenn das gewünschte Modell nicht aufgeführt ist, senden Sie uns eine Anfrage. Wir unterstützen Sie bei Verfügbarkeit, Lieferzeit und möglichen Alternativen.
FAQ
Wie wähle ich den passenden System On Chip (SoC) aus?
Prüfen Sie zuerst elektrische Parameter, Gehäuse, Betriebstemperatur, Einsatzbedingungen und Herstelleranforderungen. Danach können Verfügbarkeit und Lieferzeit verglichen werden.
Kann ich anhand des angezeigten Lagerbestands direkt bestellen?
Bestände können sich ändern. Für Projekt- oder Mengenbedarf empfehlen wir eine Anfrage zur Bestätigung von aktuellem Bestand, Preis und Lieferzeit.
Was kann ich tun, wenn die gewünschte Teilenummer nicht gelistet ist?
Senden Sie uns Teilenummer und benötigte Menge. Wir können schwer verfügbare Teile prüfen und passende Alternativen anhand der Spezifikationen vorschlagen.
Sind Datasheets und technische Unterlagen verfügbar?
Ja. Nutzen Sie die Datasheet-Links in der Produktliste. Falls Unterlagen fehlen, können Sie uns für eine zusätzliche Prüfung kontaktieren.
